|
Item ID |
Photo |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Location |
Make |
Model |
|
|
$ |
|
|
213293
|
ASM
|
ASM |
Siplace CA4 |
in Flip Chip Bonders
ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch:SIPLACE CA4: - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-Kamera (TYP34) and bonding Head C+P20 - excluding Loader
|
1
|
|
|
|
Regensburg, Bavaria |
|
|
245179
|
NGK FILTECH
|
NGK FILTECH |
MEGCON 2 |
in Wire Bonders
CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006:CO2 BUBBLER_NGK FRCII 2000ACDES_MBCO2-006 |
|
1
|
|
|
|
Malacca, Malacca |
|
|
245178
|
NGK FILTECH
|
NGK FILTECH |
MEGCON 2 |
in Wire Bonders
CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003:CO2 BUBBLER_NGK PRCII 2000ACDS_MBCO2-003 |
|
1
|
|
|
|
Malacca, Malacca |
|
|
248130
|
EKRA
|
EKRA |
Serio4000 |
in Semiconductor / Hybrid Assembly Equipment
EKRA Serio 4000:- Equipment for automated stencil printing
- Designed for automated input and output
- Printing format min 80x50mm, max 510x510
- Not suitable for manual loading and unloading
|
1
|
|
|
N* |
Regensburg, Bavaria |
|
|
235315
|
Scrap 3x mini buffers (10011500,10011501,10011502)
|
Scrap 3x mini buffers (10011500,10011501,10011502) |
in Semiconductor / Hybrid Assembly Equipment
Scrap 3x mini buffers (10011500,10011501,10011502):These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped 2: function isn't complete
|
3
|
|
|
F* |
Regensburg, Bavaria |
|
|
243278
|
EKRA
|
EKRA |
XM |
in Semiconductor / Hybrid Assembly Equipment
Screen & Stencil Printer Ekra (Asys Group):The XM is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes. The sideways guided squeegee traverse and the adjustable squeegee pressure ensure a constant, high quality print. Simple operation and short set-up times all belong to the application oriented concept. Stiff as well as flexible materials such as PCBs, glass, ceramic or metal up to a thickness of 30 mm can be printed. Due to these characteristics the XM print system is the ideal application for small batch series and for prototyping.
|
1
|
|
|
|
Regensburg, Bavaria |
|
|
245208
|
ASM Technology Singa
|
ASM Technology Singa |
Xpress GoCu |
in Wire Bonders
Wire bond ASM IHAWK XPRESS GOCU:Wire bond ASM IHAWK XPRESS GOCU with heat tunnel
|
1
|
|
0.00 |
|
Batam, Riau Islands |
|
|
245209
|
Shinkawa
|
Shinkawa |
SKW_UTC2000 |
in Wire Bonders
Wire Bond UTC2000:SW116:UTC2000:Gold wire bonder
|
1
|
|
0.00 |
|
Batam, Riau Islands |
|
|
245210
|
Shinkawa
|
Shinkawa |
SKW_UTC2000 |
in Wire Bonders
Wire Bond UTC2000:SW122:UTC2000:Gold wire bonder
|
1
|
|
0.00 |
|
Batam, Riau Islands |
|
|
245207
|
ASM
|
ASM |
Xpress GoCu |
in Wire Bonders
Wire bond Xpress GoCu:Wire bond ASM i-Hawk Xpress Go Cu: Heat Tunnel
|
1
|
|
0.00 |
|
Batam, Riau Islands |
|