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FULL DESCRIPTION of Item 153893

in Other Semiconductor Manufacturing Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 153893

Offered1 Offered at Best Price


Mold Die

Mold Die
LOCATION: Malacca
Mold Die

Location: Regensburg, BY
Unit Price Unstated
Number of Units 1
Manufacturer Fico Netherlands
Model Fico
Description Mold Die
Wafer Size Range 
  Minimum 150 mm
  Maximum 
  Set Size 
Condition Good
Year of Manufacture 2002
Power Requirements      50 Hz     3 Phase
CE Marked YES
Exterior Dimensions 
  Width 35.827  in  (91.0 cm)
  Depth 24.016  in  (61.0 cm)
  Height 11.811  in  (30.0 cm)
Weight 181  lb  (82 kg)
Shipping  Weight lb  kg 
Shipping  Limitation  Customer Pickup Only

OFFERED BY: (click name below to visit its website directly)

Infineon Technologies AG - Equipment Trade
Planning Executive
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria