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FULL DESCRIPTION of Item 191714

in Other Semiconductor Manufacturing Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 191714

Offered5 Offered at Best Price


Wire Bonder ACB1000

To bond wire on the chip in strip to strips form
Wire Bonder ACB1000

Location: Malacca, Malacca
Unit Price Unstated
Number of Units 5
Manufacturer Shinkawa
Model ACB 1000
Description WIre Bonder Machine
Condition Good
Year of Manufacture 2010
Exterior Dimensions 
  Width 35.433  in  (90.0 cm)
  Depth 38.583  in  (98.0 cm)
  Height 74.803  in  (190.0 cm)
Weight 1,036  lb  (470 kg)
Shipping  Weight lb  kg 

OFFERED BY: (click name below to visit its website directly)

Infineon Technologies AG - Equipment Trade
(IFMY OP BE DS OPC BSP)
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria