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FULL DESCRIPTION of Item 192605

in Other Semiconductor Manufacturing Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 192605

Offered3 Offered at Best Price


Die Bonder DBD4600, T8, TG17, TG7

To bond chip from wafer into strip to strips form
Die Bonder DBD4600, T8, TG17, TG7

Location: Malacca, Malacca
Unit Price Unstated
Number of Units 3
Manufacturer tosok
Model DBD4600
Description Die Bonder Machine
Condition Good
Year of Manufacture 2004
Exterior Dimensions 
  Width 49.213  in  (125.0 cm)
  Depth 86.614  in  (220.0 cm)
  Height 74.016  in  (188.0 cm)
Weight 2,205  lb  (1,000 kg)

OFFERED BY: (click name below to visit its website directly)

Infineon Technologies AG - Equipment Trade
(IFMY OP BE DS OPC BSP)
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria