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FULL DESCRIPTION of Item 176318

in Other Wafer Fabrication Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 176318

Offered1 Offered at Best Price


EVG850 Waferbonder

EVG850 Waferbonder, Year of Construction 2007

Location: Regensburg, BY
Unit Price Unstated
Number of Units 1
Manufacturer EVG
Model EVG850TB/200
Description Waferbonder for 6 inch wafers
Wafer Size Range 
  Minimum 150 mm
  Maximum 150 mm
  Set Size 150 mm
Cassette to Cassette YES
Condition Excellent
Year of Manufacture 2007
Power Requirements 230 V     6.9 A     50/60 Hz     3 Phase
click to view document at right in new windowEVG850tb.pptx

OFFERED BY: (click name below to visit its website directly)

Infineon Technologies AG - Equipment Trade
Planing department
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria