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FULL DESCRIPTION of Item 176319

in Other Wafer Fabrication Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 176319

Offered1 Offered at Best Price


EVG850 waferbonder

EVG850 Waferbonder year of Construction 2005

Location: Regensburg, BY
Unit Price Unstated
Number of Units 1
Manufacturer EVG
Model EVG850TB/200
Description Waferbonder for 6 inch wafers
Wafer Size Range 
  Minimum 150 mm
  Maximum 150 mm
  Set Size 150 mm
Cassette to Cassette YES
Accessories high pressure cleaning added in 2006
Other Information missing parts: doors, some little parts
Condition Good
Year of Manufacture 2005

OFFERED BY: (click name below to visit its website directly)

Infineon Technologies AG - Equipment Trade
Planing department
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria