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FULL DESCRIPTION of Item 237802

in Other Wafer Production Equipment 		Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 237802

Offered 1 Offered at Best Price


Laser-Silicon-Cutting System with Cuttingtable and Cabin

Complete Silicon cutting system with Laser source, cutting table and safety cabine. The system was in use until March 2023 and is currently placed into stock.

 Laser-Silicon-Cutting System with Cuttingtable and Cabin
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Location: Warstein, North Rhine-Westphalia
Unit Price Unstated
Number of Units 1
Manufacturer Trumpf
Model HL 101 P
Description Laser Cutting System
Wafer Size Range 
  Minimum 100 mm
  Maximum 150 mm
Accessories 

Cutting Table

Safety Cabin

Wafer-Chucks, Software, etc.

Condition Good
Year of Manufacture 1994
Refurbished YES

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
IFBIP PQM PROC
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria