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FULL DESCRIPTION of Item 238644

in Other Wafer Fabrication Equipment 		Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 238644

Offered 1 Offered at Best Price


Multi-Chip Die Bonder

Operations and Maintenance Manuals available.

 Multi-Chip Die Bonder
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Location: Villach, Carinthia
Unit Price Unstated
Number of Units 1
Manufacturer Datacon
Model 2200 apm
Description Multi-Chip Die Bonder
Condition Very Good
Year of Manufacture 2007

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria