ITEM ID: 229872

Microautomation M-1100 Wafer Dicing Saw

Microautomation M-1100 Wafer Dicing Saw

1 unit @ Best Price

MAKE: Micro Automation

MODEL: M-1100

CATEGORY: Dicing Saws

SELLER: Catalyst Equipmt Co

Plano, TX US

SPECS

Manufacturer Micro Automation
Model M-1100
Maximum Substrate Diameter 6.000 in (15.2 cm)
Spindle Type Air Bearings
Condition Excellent

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