Die Bond Datacon 2200 evo
Model:EVO2200:Die Attach Bonder
1 unit @ $0.00
MAKE: BESI
MODEL: EVO2200
CATEGORY: Other Semiconductor Manufacturing Equipment
SELLER: Infineon
Batam, Indonesia
SPECS
| Manufacturer | BESI |
| Model | EVO2200 |
| Accessories | Power Supply : 230 VAC Power Consumption : 2,3 KVA |
| Condition | Good |
| Year of Manufacture | 2010 |
| Exterior Dimensions | |
| Width | 48.228 in (122.5 cm) |
| Height | 68.898 in (175.0 cm) |
| Weight | 3,307 lb (1,500 kg) |
S&H
All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge, packaging, crating and delivery. We are not responsible for any damage incurred during shipment.
Payment
100% downpayment