Fabrication Systems

Fabrication systems are critical setups used in the production of semiconductor components, enabling precise layer deposition and material patterning. They enhance efficiency and precision, ensuring high-performance outcomes and reliability in semiconductor manufacturing.

  1. OSIRIS INTERNATIONAL MANUAL WAFER DEBONDING TOOL

    Other Wafer Fabrication Equipment

    OSIRIS INTERNATIONAL MANUAL WAFER DEBONDING TOOL

    Manual Wafer Debonding Tool

  2. InkJet Printer (Süss ACS200)

    Other Wafer Fabrication Equipment

    InkJet Printer (Süss ACS200)

    Süss Micro Tec ACS200 Gen 3

  3. Implant Dose Measurement

    Other Wafer Fabrication Equipment

    Implant Dose Measurement

  4. Takatori ATRM-2100 Automatic Wafer Detaper

    Other Wafer Fabrication Equipment

    Takatori ATRM-2100 Automatic Wafer Detaper

    Takatori ATRM-2100 Automatic Wafer Detaper
    • For up to 200mm Wafers
  5. Takatori ATRM-2100D Automatic Wafer Detaper

    Other Wafer Fabrication Equipment

    Takatori ATRM-2100D Automatic Wafer Detaper

    Takatori ATRM-2100D Automatic Wafer Detaper
    • For up to 200mm Wafers
    • Upgraded Control System
  6. Takatori ATM-1100E Wafer Taper

    Other Wafer Fabrication Equipment

    Takatori ATM-1100E Wafer Taper

    Takatori ATM-1100E Wafer Taper
    • For up to 200mm Wafers
    • Flat Screen Monitor
    • Upgraded Cokmputer Control System
  7. REYNOLDSTECH 16 'X 16', HOT PLATE 200° C,

    Other Wafer Fabrication Equipment

    REYNOLDSTECH 16 'X 16', HOT PLATE 200° C,

    200° C 16 " x 16" Hot Plate with Vacuum Hold Down

  8. LOGITECH WAFER BONDER CONTROLLER

    Other Wafer Fabrication Equipment

    LOGITECH WAFER BONDER CONTROLLER

    Wafer Bonder Controller

  9. EV GROUP SMARTVIEW® BOND ALIGNER

    Other Wafer Fabrication Equipment

    EV GROUP SMARTVIEW® BOND ALIGNER

    2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.

    A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.

  10. SHARON VACUUM WAFER BONDER

    Other Wafer Fabrication Equipment

    SHARON VACUUM WAFER BONDER

    Wafer Bonder Sharon Vacuum

  11. 286HT-8-10EPTI3 8" Quartz Boat for 5 Wafers

    Other Wafer Fabrication Equipment

    286HT-8-10EPTI3 8" Quartz Boat for 5 Wafers

    286HT-8-10EPTI3 8" Quartz Boat for 5 Wafers

Common Applications

semiconductor wafer manufacturing

integrated circuit production

microprocessor fabrication

memory chip manufacturing

photonic device production

sensor manufacturing

Buying Guide

Fabrication Systems Buying Considerations

  • Evaluate system compatibility with existing manufacturing processes to ensure seamless integration.
  • Consider throughput and processing speed to match production demands.
  • Assess the precision and accuracy of material patterning capabilities.
  • Check for advanced technology features that support specific manufacturing requirements.
  • Look into system scalability to accommodate future process expansions.

Frequently Asked Questions

What are semiconductor fabrication systems?
Semiconductor fabrication systems are integrated setups designed to manage various stages of semiconductor manufacturing, including layer deposition and patterning.
Why are fabrication systems important in semiconductor manufacturing?
They are vital for ensuring the precision and efficiency required in producing high-quality semiconductor components.
What should be considered when selecting a fabrication system?
Consider the system's compatibility with existing processes, throughput capacity, and technological advancements relevant to your manufacturing needs.
Which industries use semiconductor fabrication systems?
These systems are primarily used in the electronics industry for manufacturing semiconductors used in various electronic devices.