BESI Datacon 2200 evo plus Automatic Die Bonder
BESI Datacon 2200 evo plus Automatic Die Bonder
- Newer Used in Production
- Die Attach, Flip Chip & Multi-Chip Capability
- Upgraded Camera
- Upgraded Image Processing Unit
- Large Format Heated Stage
- Thermal Compensation
- Open Platform Architecture
1 unit @ Best Price
MAKE: BESI
MODEL: Datacon 2200 evo plus
CATEGORY: Automatic Epoxy Die Bonders
SELLER: Catalyst Equipmt Co
Plano, TX US
SPECS
| Manufacturer | BESI |
| Model | Datacon 2200 evo plus |
| Description | Automatic Die Bonder |
| Condition | Like New |
| Year of Manufacture | 2022 |
| CE Marked | YES |
| Weight | 3,307 lb (1,500 kg) |
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