Bonding & Packaging Equipment
Bonding and packaging equipment are specialized machines used in manufacturing to securely fasten and protect products. They ensure product integrity, streamline operations, and enhance production outcomes.
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KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica GZ6 Microscope
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MECH-EL EUTECTIC DIE BONDER
The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
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KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica MZ6 Microscope
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WEST-BOND ULTRASONIC WEDGE WIRE BONDER
Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation
Representative photo
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BESI Datacon 2200 evo plus Automatic Die Bonder
BESI Datacon 2200 evo plus Automatic Die Bonder
- Newer Used in Production
- Die Attach, Flip Chip & Multi-Chip Capability
- Upgraded Camera
- Upgraded Image Processing Unit
- Large Format Heated Stage
- Thermal Compensation
- Open Platform Architecture
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WEST-BOND AUTOMATIC WEDGE BONDER
Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically
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Common Applications
food packaging
automotive assembly
electronics casing
consumer goods packaging
aerospace component bonding
pharmaceutical packaging
Frequently Asked Questions
What types of bonding equipment are available?
How does packaging equipment improve manufacturing?
Can this equipment handle multiple product sizes?
What maintenance is required for these systems?
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