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FULL DESCRIPTION of Item 245212

in Other Semiconductor Manufacturing Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 245212

Offered 1 Offered at Best Price


Die Bonder ESEC 2008xP

DA,ED 111,ESEC 2008 DIE BONDER

Type : D-160

Die Bonder ESEC 2008xP

Location: Batam, Riau Islands
Unit Price $ 0.00
Number of Units 1
Manufacturer BESI
Model Die Bonder 2008xP
Other Information 

Power Supply : 100 - 240 V AC

Power Consumption : 2,2 KVA

Condition Good
Year of Manufacture 2004
Power Requirements 240 V     60 Hz     1¬†Phase
Exterior Dimensions 
  Width 51.181  in  (130.0 cm)
  Height 92.520  in  (235.0 cm)
Weight 1,543  lb  (700 kg)

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria