Manual Ball Bonders
KULICKE & SOFFA K&S MANUAL BALL BONDER
Manual Ball Bonder
Bonding & Packaging Equipment
Bonding and packaging equipment are specialized machines used in manufacturing to securely fasten and protect products. They ensure product integrity, streamline operations, and enhance production outcomes.
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Manual Ball Bonders
KULICKE & SOFFA K&S MANUAL BALL BONDER
Manual Ball Bonder
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Manual Wedge Bonders
KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica GZ6 Microscope
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Manual Eutectic Die Bonders
MECH-EL EUTECTIC DIE BONDER
The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
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Manual Wedge Bonders
KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica MZ6 Microscope
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Manual Wedge Bonders
WEST-BOND ULTRASONIC WEDGE WIRE BONDER
Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation
Representative photo
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Automatic Epoxy Die Bonders
BESI Datacon 2200 evo plus Automatic Die Bonder
BESI Datacon 2200 evo plus Automatic Die Bonder
- Newer Used in Production
- Die Attach, Flip Chip & Multi-Chip Capability
- Upgraded Camera
- Upgraded Image Processing Unit
- Large Format Heated Stage
- Thermal Compensation
- Open Platform Architecture
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Automatic Wedge Bonders
F&K DELVOTEC AUTOMATIC WEDGE BONDER
Automatic Wedge Bonder
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Automatic Epoxy Die Bonders
HYBOND SEMIAUTOMATIC EPOXY DIE BONDER
Semiautomatic Epoxy Die Bonder
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Automatic Wedge Bonders
WEST-BOND AUTOMATIC WEDGE BONDER
Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically
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Automatic Ball Bonders
K&S 1488 Plus
Automatic Gold Ball Bonder -
Manual Wedge Bonders
WEST-BOND MANUAL WEDGE BONDER
Manual Wedge Bonder
Common Applications
food packaging
automotive assembly
electronics casing
consumer goods packaging
aerospace component bonding
pharmaceutical packaging
Frequently Asked Questions
What types of bonding equipment are available?
Types include adhesive applicators, thermal bonders, ultrasonic welders, and pressure-sensitive tape dispensers.
How does packaging equipment improve manufacturing?
Packaging equipment increases efficiency by speeding up the packing process and ensuring consistent quality.
Can this equipment handle multiple product sizes?
Many machines are adjustable or come with interchangeable parts for different sizes.
What maintenance is required for these systems?
Regular cleaning and inspection of moving parts, along with timely replacement of consumables, ensure optimal performance.