Item ID Item Description Description Size Range Cass to Cass # Price Notes Location Make Model Set Size $
237874
Accretech UF200A TSK-Prober
1
N*
Villach, Carinthia
237876
Accretech UF200A TSK-Prober
1
N*
Villach, Carinthia
237877
Accretech UF3000EX-e TSK-Prober
1
N*
Villach, Carinthia
237878
Accretech UF3000EX-e TSK-Prober
1
N*
Villach, Carinthia
235779
Brooks MTX2000/2 Wafer Sorter 300 mm YES
1
Villach, Carinthia
238644
Datacon 2200 apm Multi-Chip Die Bonder
1
N*
Villach, Carinthia
224956
Mechatronic 300mm Sorter 300 mm YES
1
Villach, Carinthia
224568
Mechatronic 300mm Sorter 300 mm YES
1
Villach, Carinthia
238643
PVA TePla TWIN Implant Dose Measurement
1
N*
Villach, Carinthia
236071
Rudolph Technologies NSX-115 Automated Wafer, Die & Bump Inspection
1
Villach, Carinthia
237233
Suss MicroTec CB200 High Pressure Bonding Chamber
1
N*
Villach, Carinthia
221452
Yushin Demounter 200 mm YES
1
Villach, Carinthia
NOTE:
photo available
reference document attached
F* if the item is specially featured
N* if the item is newly added, and/or
R* if the item's price is recently reduced.