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Semiconductor / Hybrid Assembly Equipment


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Group Listings into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Listings into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment


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 Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes Location
Make Model
  $  
203803
Shinkawa  

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot 28,090.71 Regensburg, Bavaria
200489
ESEC  

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2   Regensburg, Bavaria
203804
Heraeus Oven & Oven Table 
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot 356.45 Regensburg, Bavaria
204631
Lauffer Mold Press  
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 29,046.78 Regensburg, Bavaria
158359
Shinkawa  

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1   Regensburg, BY
158364
Shinkawa  

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1   F* Regensburg, Bavaria
204719
SHINKAWA ACB35 Wire Bond 
SHINKAWA ACB35 Wire Bond 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 Wire Bond:
100060530SHINKAWA ACB35 Wire Bond
100068240VISUAL INSPECTION SYSTEM
100068241hookup: VISUAL INSPECTION SYSTEM
100073050VISION INSPECTION MACHINE
3 15,738.84 Regensburg, Bavaria
199782
Shinkawa  

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi

4   Regensburg, Bavaria
203821
Shinkawa  

Shinkawa  

ACB400 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB400 WIRE BOND:

SHINKAWA WIRE BOND ACB400 10007322

WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT


LOCATION: Wuxi
1 10,957.50 Regensburg, Bavaria
192458
tosok  

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1   Regensburg, Bavaria
204630
TOSOK DBD3310 3280 DIE BOND 
TOSOK DBD3310 3280 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 75,532.68 Regensburg, Bavaria
199781
tosok  

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4   Regensburg, Bavaria


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment:
ESEC, Shinkawa, tosok