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Semiconductor / Hybrid Assembly Equipment


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 Assembly / Hybrid - Other  in Semiconductor / Hybrid Assembly Equipment  (18)

 Assembly Materials  in Semiconductor / Hybrid Assembly Equipment  (no items)

 Assembly Test Tools - Other  in Assembly Test  (no items)

 Automatic Ball Bonders  in Ball Bonders  (no items)

 Automatic Epoxy Die Bonders  in Epoxy Die Bonders  (no items)

 Automatic Eutectic Die Bonders  in Eutectic Die Bonders  (no items)

 Automatic Flip Chip Bonders  in Flip Chip Bonders  (8)

 Automatic Wedge Bonders  in Wedge Bonders  (no items)

 Bubble Testers  in Leak Detectors  (no items)

 Cap Welders  in Welders  (no items)

 Centrifuges  in Production Process Equipment  (no items)

 Diamond Scribers  in Dicing Tools  (no items)

 Dicing Saws  in Dicing Tools  (no items)

 Dicing Tools - Other  in Dicing Tools  (no items)

 Die Shear Testers  in Assembly Test  (no items)

 Dispensing/Coating Equipment  in Packaging Tools  (no items)

 Film/Wafer Mounters  in Dicing Tools  (2)

 Glass Package Sealers  in Packaging Tools  (no items)

 Helium Leak Detectors  in Vacuum Processing Equipment  (no items)

 Injection Molding Presses  in Plastics Processing Equipment  (no items)

 Inner Lead Bonders  in TAB Bonders  (no items)

 Laser Package Marking Tools  in Marking Tools  (no items)

 Lead Forming Tools  in Lead Processing Tools  (no items)

 Lead Inspection Tools  in Lead Processing Tools  (no items)

 Lead Processing Equipment - Other  in Lead Processing Tools  (no items)

 Lead Welders  in Welders  (no items)

 Manual Ball Bonders  in Ball Bonders  (no items)

 Manual Epoxy Die Bonders  in Epoxy Die Bonders  (no items)

 Manual Eutectic Die Bonders  in Eutectic Die Bonders  (no items)

 Manual Flip Chip Bonders  in Flip Chip Bonders  (no items)

 Manual Wedge Bonders  in Wedge Bonders  (no items)

 Marking Tools - Other  in Marking Tools  (no items)

 Molding Equipment - Other  in Molding Presses  (no items)

 Offset Package Marking Tools  in Marking Tools  (no items)

 Outer Lead Bonders  in TAB Bonders  (no items)

 Packaging Tools - Other  in Packaging Tools  (no items)

 Pad Printers  in Marking Tools  (no items)

 Pick and Place Machines  in Assembly Robotics  (no items)

 PIND Testers  in Assembly Test  (no items)

 Pressurization Stations  in Package Leak Testers  (no items)

 Robots  in Assembly Robotics  (no items)

 Screen Printers  in Semiconductor / Hybrid Assembly Equipment  (1)

 Sealing Furnaces  in Packaging Tools  (no items)

 Sealing/Welding Systems  in Packaging Tools  (no items)

 Seam Sealers  in Welders  (no items)

 Singulation Presses  in Lead Processing Tools  (no items)

 Tape & Reel Tools  in Packaging Tools  (no items)

 Transfer Molding Presses  in Molding Presses  (no items)

 Wire Bond Pull Testers  in Assembly Test  (no items)

 Wire Bond Shear Testers  in Assembly Test  (no items)

 Wire Bonding Equipment - Other  in Wire Bonders  (2)

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment:
Alphasem, EKRA, ESEC, fujiwa, FUSEI, hull finmac, Orthodyne, Soft View Technology, Tazmo Co.,Ltd.