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	View All Listings Under Semiconductor / Hybrid Assembly Equipment » Switch Major Category		Click an item's ID# below for its full specifications and source, or: Group Listings into sub-categories under Semiconductor / Hybrid Assembly Equipment List all 51 product types under Semiconductor / Hybrid Assembly Equipment

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Item ID  Photo Short Description Product Type / Details # Price Notes Location Make Model   $   255419 ESEC   ESEC   2007 ESEC  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacture 205940 2007 ESEC 1   Tijuana, Baja California 255584 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 208424 2007 ESEC 1   Tijuana, Baja California 255585 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 209377 2007 ESEC 1   Tijuana, Baja California 255586 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: Serial Number Model Manufacturer 204882 2007 ESEC 1   Tijuana, Baja California 255587 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 1   Tijuana, Baja California 255588 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 1   Tijuana, Baja California 256626 ESEC   ESEC   2007  Automatic Flip Chip Bonders in Flip Chip Bonders 2007 ESEC Die Bonder: 2007 ESEC Die Bonder 1   N* Tijuana, Baja California 255416 fujiwa   fujiwa   250-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 250-70 FUJIWA / Mold Press: Serial Number Model Manufacturer 2534 250-70 FUJIWA 1   Tijuana, Baja California 255589 Orthodyne   Orthodyne   360C  Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE Wire Bonder: 360C ORTHODYNE Wire Bonder 1   Tijuana, Baja California 256653 Orthodyne   Orthodyne   360C  Wire Bonding Equipment - Other in Wire Bonders 360C ORTHODYNE WIRE BONDER: 360C ORTHODYNE WIRE BONDER 1   N* Tijuana, Baja California 256655 hull   hull   4216LP-D  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment 4216LP-D HULL_FINMAC DEFLASH: 4216LP-D HULL_FINMAC DEFLASH 1   N* Tijuana, Baja California 256654 hull   hull   BT4216LP  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment BT4216LP HULL_FINMAC DEFLASH: BT4216LP HULL_FINMAC DEFLASH 1   N* Tijuana, Baja California 256629 Soft View Technology   Soft View Technology   SVDS  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to die plate or tape and reel. Location is at Infineon Penang. 1   N* George Town, Penang 248130 EKRA   EKRA   Serio4000  Screen Printers in Semiconductor / Hybrid Assembly Equipment EKRA Serio 4000: Equipment for automated stencil printing  Designed for automated input and output Printing format min 80x50mm, max 510x510 Not suitable for manual loading and unloading 1   Regensburg, Bavaria 255417 ESEC   ESEC   ESEC 2007  Automatic Flip Chip Bonders in Flip Chip Bonders ESEC 2007 DIE BONDER: Serial Number Model Manufacturer 205940 2007 ESEC 1   Tijuana, Baja California 256642 FUSEI   FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS 1   N* Tijuana, Baja California 256643 FUSEI   FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI MOLD PRESS: FMTM250-7HS-32P FUSEI MOLD PRESS 1   N* Tijuana, Baja California 256645 FUSEI   FUSEI   FMTM250-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM250-7HS-32P FUSEI_MENIX MOLD PRESS 1   N* Tijuana, Baja California 256649 FUSEI   FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* Tijuana, Baja California 256650 FUSEI   FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* Tijuana, Baja California 256651 FUSEI   FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI MOLD PRESS: FMTM300-7HS-32P FUSEI MOLD PRESS 1   N* Tijuana, Baja California 256648 FUSEI   FUSEI   FMTM300-7HS-32P  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS: FMTM300-7HS-32P FUSEI_MENIX MOLD PRESS 1   N* Tijuana, Baja California 254740 Tazmo Co.,Ltd.   Tazmo Co.,Ltd.   Mounter 2 Glass   Film/Wafer Mounters in Dicing Tools 1   Villach, Kärnten 235315 Scrap 3x mini buffers (10011500,10011501,10011502)  Scrap 3x mini buffers (10011500,10011501,10011502)  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Scrap 3x mini buffers (10011500,10011501,10011502): These 3 mini buffers (10011500,10011501,10011502) will be scrap because 1: linked machines were already scrapped  2: function isn't complete 3   F* Regensburg, Bavaria 256639 fujiwa   fujiwa   SD250  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment SD250 FUJIWA MOLD PRESS: SD250 FUJIWA MOLD PRESS 1   N* Tijuana, Baja California 256630 Alphasem   Alphasem   SL9001  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment Swissline Die Sorter (Pick & Place): Transferring die from sawn wafer (mounted frame) to tape and reel. Location is at Infineon Penang. 1   N* George Town, Penang 256344 Tazmo Co.,Ltd.   Tazmo Co.,Ltd.   Tazmo Mounter 4  Film/Wafer Mounters in Dicing Tools 1   N* Villach, Carinthia 256638 fujiwa   fujiwa   TEP-200-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS 1   N* Tijuana, Baja California 257110 fujiwa   fujiwa   TEP-200-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-200-70 FUJIWA MOLD PRESS: TEP-200-70 FUJIWA MOLD PRESS 1   N* Tijuana, Baja California 255415 fujiwa   fujiwa   TEP-250  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-250 FUJIWA / MOLD PRESS: Serial Number Model Manufacturer 2562 TEP-250 FUJIWA 1   Tijuana, Baja California 256640 fujiwa   fujiwa   TEP-250-70  Assembly / Hybrid - Other in Semiconductor / Hybrid Assembly Equipment TEP-250-70 FUJIWA MOLD PRESS: TEP-250-70 FUJIWA MOLD PRESS 1   N* Tijuana, Baja California

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
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   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment: Alphasem, EKRA, ESEC, fujiwa, FUSEI, hull finmac, Orthodyne, Soft View Technology, Tazmo Co.,Ltd.