Scrap 3x mini buffers (10011500,10011501,10011502)
These 3 mini buffers (10011500,10011501,10011502) will be scrap because
1: linked machines were already scrapped
2: function isn't complete
Hybrid Electronic Assemblies
Hybrid electronic assemblies combine different electronic components to create complex and efficient systems for industrial purposes. They enhance performance and reliability in varied electronics applications.
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AQUEOUS TECHNOLOGIES ULTRASONIC STENCIL CLEANING SYSTEM
Ultrasonic Stencil Cleaning System
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Die Sorter (Pick & Place)
Transferring die from sawn wafer (mounted frame) to die plate or tape and reel.
Location is at Infineon Penang.
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ULTRA T EQUIPMENT WAFER PHOTOMASK AND SUBSTRATE CLEANING SYSTEM
Manual Wafer, Photomask and Substrate Cleaning System
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ULTRA T EQUIPMENT CO. SAWED WAFER CLEANER 6"
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Glow Research GLM200 Plasma Cleaning Tool
Glow Research GLM200 Plasma Cleaning Tool
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EAV_ACA AQN2D2_EAV003
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Common Applications
telecommunications
automotive electronics
medical devices
aerospace systems
industrial automation
renewable energy systems
Frequently Asked Questions
What are hybrid electronic assemblies?
Hybrid electronic assemblies are systems that combine various electronic components to enhance performance and efficiency.
How do hybrid electronic assemblies improve industrial applications?
They offer greater functionality and flexibility in designing custom industrial solutions.
What should be considered when selecting hybrid assemblies?
Consider compatibility with existing systems, performance specifications, and durability.
Are there different types of hybrid electronic assemblies?
Yes, common types include RF hybrid circuits, power hybrids, and module assemblies.
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