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 Wire Bonding Equipment - Other  in Wire Bonders  (2)

 Screen Printers  in Semiconductor / Hybrid Assembly Equipment  (1)

 Film/Wafer Mounters  in Dicing Tools  (2)

 Automatic Flip Chip Bonders  in Flip Chip Bonders  (8)

 Assembly / Hybrid - Other  in Semiconductor / Hybrid Assembly Equipment  (18)

Items from the following manufacturers are offered under Semiconductor / Hybrid Assembly Equipment:
Alphasem, EKRA, ESEC, fujiwa, FUSEI, hull finmac, Orthodyne, Soft View Technology, Tazmo Co.,Ltd.