Inductively Coupled Plasma Etcher with 9.5 Inch Electrode

Reactive Ion Etch System

BatchTop VII

Single Chamber PECVD. Mixed Frequency Deposition (MFD) Both High Frequency (13.56 MHz) and Low Frequency (50-460 kHz) RF power delivered both electrodes.

Shuttle Load Lock System

Combination PECVD and Dual Plasma Etch/Reactive Ion Etch Processing Systems

Reactive Ion Etch / PECVD system mounted in glovebox with an intregrated air purfier O2 and H20 sensors on board. Both top and bottom electrodes can be powered sequentially.

Dual Plasma Etch and Reactive Ion Etch Processing Systems System consists of a process chamber, upper electrode (with gas feed), and substrate electrode.

PLASMA-THERM 790 Reactive Ion Etcher; Serial Number PTI-78272F

• Manually Loaded Process Chamber with 8” (dia.) Cathode
• Gas Distribution Panel with 4ea Gas Channels
  • MKS 1479 Metal Sealed Mass Flow Controllers
  • 4ea Additional Gas Channels Available
  • RFPP RF5S RF Generator: 500W @ 13.56MHz
  • RFPP AMN-5 Auto Matching Network
  • RFPP AMNPS-2A Auto Matching Network Controller
  • Leybold TMP 361 Turbomolecular Pump
  • Leybold NT 150/360 Turbomolecular Pump Controller
  • EquipmentWorks 2.6 Application SW
  • Industrial PC Running UBUNTU LINUX OS, Intel I7 CPU at 3.4 GHz,16Gb RAM & 500GB SSD
  • All Analog & Digital I/O Modules Controlled by BECKHOFF Ethernet I/O Via Modbus TCP/IP Communications Protocol.
  • All I/O Modules Available from BECKHOFF Automation and are Plug & Play Compatible
  • All Pneumatic Valves Controlled by SMC Modules Via Modbus TCP/IP Communications Protocol
  • All SMC Pneumatic Valves Available from SMC USA
  • Standard 21” Flat Panel Monitor, Keyboard & Mouse
  • Edwards QDP40 Dry Roughing Pump
  • NESLAB HX-75 Chiller
  • Electrical Disconnect Box - 208V, 60Hz, 3 Ph
  • System Fully Refurbished & Ready for Demonstration
  • Guaranteed to Meet or Exceed OEM Specifications
  • Price……$ 80,000.00 USD

PLASMA-THERM SLR 770 Inductively Coupled Plasma Etcher

• Single Process Chamber with SLR (Shuttle Lock Transfer) Load Lock
• Manual Load with Load Lock Handling Currently Configured for 4” Wafers
• Ceramic Wafer Clamp with Helium Backside Cooling System
• Gas Distribution Box with 5ea Gas Channels
• ENI ACG-6 RF Generator: 600W @ 13.56MHz
• ENI Automatic Matching Network
• RFPP RF20M RF Generator: 2000W @ 2.0MHz
• RFPP Automatic Matching Network
• Six Zone Chamber Heater with Temperature Controller
• LEYBOLD 900 Turbo Pump with Mag 1000 Controller
• MKS ITR Ion Gauge Controller
• VAT Gate Valve with PM-5 Controller
• Mechanical Roughing Pump
• NESLAB HX-75 Chiller
• Electrical Disconnect Box - 208V, 60Hz, 3 phase