Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation
Representative photo
Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically
Semi-Automatic Wedge Bonder Model 4500B operates under microprocessor control with user-programmed memory to stitch bond a succession of parallel multi-arch wires, requiring an operator only to position the critical bond target. Each increment of motion of tool and work in both Z and Y directions is chosen by stepper motors under program control so that the resulting wire connections have identical shapes. This is ideal for bonding high power, high frequency devices where it is necessary to hold the mutual inductance of parallel wires constant.
West-Bond 7201CR-79 Dual Dispense Epoxy Die Bonder
West-Bond 7600C-79C Deep Access Wedge Bonder
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