Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

Representative photo

Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically

Manual Wedge Bonder

West-Bond 7201CR-79 Dual Dispense Epoxy Die Bonder

• Fully Programmable Microprocessor Controlled Epoxy Dispensing 
• Manual X-Y-Z Movement
• 0.001" Z Encoder Resolution
• Dual Epoxy Reservoirs
• 360° Rotating Vacuum Pickup Tool
• Adjustable Height Work Platform
• Olympus SZ51 Stereo Zoom Microscope
• West-Bond Luxuray II LED Illuminator 

West-Bond 7600C-79C Deep Access Wedge Bonder

• 2" (dia.) Heated Workholder
• West-Bond K1200D Temperature Controller
• West-Bond K1400K Onboard Ultrasonic Generator
• LEICA StereoZoom 4 Microscope
• Tool Heat