Manual Wedge Bonders

Manual wedge bonders are precision tools that join wires to contacts in semiconductor devices. They ensure reliable connections necessary for optimal electronic performance.

  1. WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Manual Wedge Bonders

    WEST-BOND ULTRASONIC WEDGE WIRE BONDER

    Ultrasonic Wedge Wire Bonder Designed to interconnect wire leads to semi-conductor, hybrid or microwave devices.Machine bonds insulated wire directly to thin film gold without the need to strip off insulation

    Representative photo

  2. West-Bond 7600C-79C Deep Access Wedge Bonder

    Manual Wedge Bonders

    West-Bond 7600C-79C Deep Access Wedge Bonder

    West-Bond 7600C-79C Deep Access Wedge Bonder

    • 2" (dia.) Heated Workholder
    • West-Bond K1200D Temperature Controller
    • West-Bond K1400K Onboard Ultrasonic Generator
    • LEICA StereoZoom 4 Microscope
    • Tool Heat

Common Applications

semiconductor manufacturing

hybrid circuit assembly

solar cell fabrication

RFID production

LED bonding

medical device assembly

Buying Guide

Manual Wedge Bonders Buying Considerations

  • Assess compatibility with wire materials like gold or aluminum for your applications.
  • Consider the machine's ability to handle varying wire diameters and bond pitches.
  • Evaluate user interface and manual controls for precision and ease of operation.
  • Check for ultrasonic power output suitability for your specific bonding needs.
  • Review service and support options from manufacturers or suppliers.

Frequently Asked Questions

What is a manual wedge bonder used for?
It is used to attach wires to semiconductor devices, ensuring strong and precise connections.
How does a manual wedge bonder work?
It uses ultrasonic energy and a wedge-shaped tool to bond thin wires to surfaces under pressure.
What types of wires are used in manual wedge bonding?
Common wire types include gold, aluminum, and copper, selected based on application needs.
Can manual wedge bonders handle different wire sizes?
Yes, they are capable of bonding various wire diameters by adjusting tool and force settings.