Other Wafer Production Equipment

List other sub-categories under Production Equipment

Show other product types under Production Equipment

	Item ID	Item Description		Description	Size Range	Cass to Cass	#		Price	Notes	Location
		Make	Model		Set Size
									$
	223524	ASM A412					1				Regensburg, Bavaria
	244704	Disco	DISCO6	Grinder	200 mm	YES	1			N*	Villach, Carinthia
	244705	Disco	DISCO9	Grinder	200 mm	YES	1			N*	Vienna, Vienna
	244317	Innolas GmbH	C3000DPS		300 mm	YES	1		32,925.39	N*	Villach, Carinthia
	244703	Nitto Denko	PFM5	Laminator	200 mm	YES	1			N*	Villach, Carinthia
	244702	Nitto Denko	PFP10	Delaminator	300 mm	YES	1			N*	Villach, Carinthia
	244701	Nitto Denko	PFP3	Delaminator	200 mm	YES	1			N*	Villach, Carinthia
	204935	Rorze	RSR160	Reticle Handler			1				Malta, New York
	237802	Trumpf	HL 101 P	Laser Cutting System			1				Warstein, North Rhine-Westphalia
	238362	Trumpf	HL 101 P	Laser-Silicon-Cutting System with CNC-cutting t...			1				Warstein, North Rhine-Westphalia
	238364	Trumpf	HL 101 P	Laser-Silicon-Cutting System with CNC-cutting t...			1				Warstein, North Rhine-Westphalia
	238310	Trumpf	HL101P	LASERSCHNEIDZENTRUM Quelle HL101P			1				Warstein, North Rhine-Westphalia

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.