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FULL DESCRIPTION of Item 232885

in Automatic Flip Chip Bonders
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 232885

Offered 1 Offered at Best Price


TOSOK DBD4600 DIE BONDER

TOSOK DBD4600 DIE BONDER

TOSOK DBD4600 DIE BONDER
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Location: Malacca, Malacca
Unit Price Unstated
Number of Units 1
Manufacturer tosok
Model  Texus DBD4600
Description DA_TOSOK DBD4600
Accessories 

Keyboard holder, Monitor bracket, Logbook holder

Other Information 

 Machine capable of running diffusion/eutectic/flip chip technology with 8 inch wafer table. 

Condition Good
Year of Manufacture 2014
Exterior Dimensions 
  Width 86.614  in  (220.0 cm)
  Depth 49.213  in  (125.0 cm)
  Height 74.016  in  (188.0 cm)
Weight 3,086  lb  (1,400 kg)

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
IFMY OPC SPP AI
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria