Where corporate owners offer without commissions their surplus and used production equipment   more...

Serving  Our Guest Log in    Register

View prices in  $ or ...

ALL CATEGORIES   Semiconductor Mfg   Semi / Hybrid Assy   Die Bonders   Flip Chip Bonders

View    Search-by-Specs

Item ID: 232886

1 Offered at Best Price TOSOK DBD4600 DIE BONDER TOSOK DBD4600 DIE BONDER   ... other images

Location: Malacca, Malacca

Unit Price	Unstated
Number of Units	1
Manufacturer	tosok
Model	Texus DBD4600
Description	DA_TOSOK DBD4600
Accessories	Keyboard holder, Monitor bracket, Logbook holder
Other Information	Machine capable of running diffusion/eutectic/flip chip technology with 8 inch wafer table.
Condition	Good
Year of Manufacture	2014
Exterior Dimensions
Width	86.614  in  (220.0 cm)
Depth	49.213  in  (125.0 cm)
Height	74.016  in  (188.0 cm)
Weight	3,086  lb  (1,400 kg)

OFFERED BY:

(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
IFMY OPC SPP AI
Regensburg , Bavaria
+49 941 202 2755

 

Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 

Payment:

100% downpayment

 

Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria   Make OFFERSend an INQUIRY