Where corporate owners offer without commissions
their surplus and used production equipment
  more... 
SPECIALS LISTINGS: Offered/Wanted
About Us Contact Us Terms & Conditions
Serving  Our Guest Log in    Register View prices in  $ or ...    
ALL CATEGORIES   Semiconductor Mfg    View    Search-by-Specs   

FULL DESCRIPTION of Item 236999

in Other Semiconductor Manufacturing Equipment 		Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 236999

Offered 5 lot Offered at Best Price


ESEC 2008 Die Bonder Scrap

GT&HAZE Line scrap,FCOS datacon L14 scrap:

ESEC2008 DIE BONDER 5 sets

Internal Equipment ID :E2-011/E2-031/E2-061/E2-071/ E2-081

 

Location: Regensburg, Bavaria
Unit Price Unstated
Number of Units
(in lot)		 5
Condition Poor
Year of Manufacture 2003

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
OPC
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria