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KLA Surfscan 6420
Specification: Automatic Surface Inspection System Bare Wafer Surface Defect Inspection System Substrate/Sizes: 6" and 8" Wafer Capable Thickness: SEMI Standard Wafer Thickness Throughput: 100 wph (200 mm) at 0.12 mm Illumination Source: 30 mW Argon-Ion laser, 488 nm Wavelength Facilities: Vaccum: 6mm (0.25 in.) line – 500mm (20 in.) of Hg / flow rate 0.24 l/s Ducted Venting: two 100mm (4 in.) exhaust hoses Power: 200-240V, 50/60 Hz, 2kVA Environment: ≥Class 10 Dimensions: Width: 76cm (30 in.) Depth: 104cm (41 in.) Height: 168cm (66 in.) Weight: 330kg (726 lbs)
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