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FULL DESCRIPTION of Item 245213

in Other Semiconductor Manufacturing Equipment
Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria
 
Item ID: 245213

Offered 1 Offered at Best Price


Die Bonder ESEC 2007 SSI Plus

Die Bonder ESEC 2007 SSI Plus

Type : D-350

Die Bonder ESEC 2007 SSI Plus

Location: Batam, Riau Islands
Unit Price $ 0.00
Number of Units 1
Manufacturer BESI
Model DB 2007 SSI plus
Other Information 

Power Supply : 200 - 415 VAC

Power Consumption : 10 KVA

 

Condition Good
Year of Manufacture 2006
Power Requirements Other V     60 Hz     3¬†Phase
Exterior Dimensions 
  Width 77.559  in  (197.0 cm)
  Height 69.291  in  (176.0 cm)
Weight 1,830  lb  (830 kg)

OFFERED BY:
(click name below to visit its website directly)
Infineon Technologies AG - Equipment Trade
Regensburg , Bavaria
+49 941 202 2755
 
Shipping & Handling:

All items are sold on condition `as is and where is`. Ex work from current location excluding de-installation, de-hook up, discharge,  packaging, crating and delivery. We are not responsible for any damage incurred during shipment.

 
Payment:

100% downpayment
 


Deal directly with Owner:  Infineon Technologies AG - Equipment Trade of Regensburg, Bavaria